Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-03-13
2007-03-13
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
11078047
ABSTRACT:
A method and apparatus for thermal testing of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and positioning temperature sensors within a corresponding semiconductor chip in accordance with the calculated full-chip temperatures (e.g., in the regions of steep thermal gradients). Thus, temperature sensors are strategically placed in the regions where they are most likely to be needed, according to calculated temperatures, rather than randomly positioned throughout a test chip.
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Chandra Rajit
Lanza Lucio
Chiang Jack
Gradient Design Automation Inc.
Tat Binh
Tong, Esq. Kin-Wah
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