Method and apparatus for the manufacture of a semiconductor inte

Details Method and apparatus for the manufacture of a semiconductor inte Method and apparatus for the manufacture of a semiconductor inte

1997-09-30

1999-05-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438113, 438114, H01L 2146

Patent

active

058997296

ABSTRACT:
A semiconductor wafer having an active surface separated into device regions with semiconductor chips formed thereon and scribe regions formed between the device regions. The wafer includes an insulating layer formed on the active surface in the device regions. The insulating layer has a first edge and a second edge oriented in a confronting relationship. The first edge and the second edge end at the scribe regions.

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patent: 5593925 (1997-01-01), Yamaha

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