Method and apparatus for the improvement of material/voltage...

Radiant energy – Inspection of solids or liquids by charged particles – Electron probe type

Reexamination Certificate

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Details

C250S492100, C438S010000, C438S018000, C716S030000, C716S030000, C257SE21521

Reexamination Certificate

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07488937

ABSTRACT:
A method and system for registering a CAD layout to a Focused Ion Beam image for through-the substrate probing, without using an optical image and without requiring biasing, includes an improved method of trench endpointing during the FIB milling operation with a low beam energy. The method further includes removal of Ga at the trench floor using XeF2, as well as the deposition of an insulating layer onto the trench floor.

REFERENCES:
patent: 6372627 (2002-04-01), Ring et al.
patent: 6955930 (2005-10-01), Le Roy et al.
patent: 2002/0151091 (2002-10-01), Shaw et al.

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