Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2005-10-25
2005-10-25
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C324S765010, C204S192330, C204S192340
Reexamination Certificate
active
06958248
ABSTRACT:
A method and system for registering a CAD layout to a Focused Ion Beam image for through-the substrate probing, without using an optical image and without requiring biasing, includes an improved method of trench endpointing during the FIB milling operation with a low beam energy. The method further includes removal of Ga at the trench floor using XeF2, as well as the deposition of an insulating layer onto the trench floor.
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Le Roy Erwan
Thompson William B.
Credence Systems Corporation
Ghyka Alexander
Wenocur Deborah
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