Method and apparatus for the coating of substrates

Details Method and apparatus for the coating of substrates Method and apparatus for the coating of substrates

1993-07-28

1994-08-23

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429825, 20429826, 20429827, C23C 1434

Patent

active

053404548

ABSTRACT:
Method and apparatus for the coating of substrates (1, 1', . . . ), preferably by cathode sputtering in a vacuum apparatus consisting of at least one sputtering chamber (6) in which different coating systems can be applied to the preferably curved substrates to be coated (1, 1', . . . ), the substrates (1, 1', . . . ) can be moved in a direction B through the vacuum apparatus and pass through the sputtering chamber (6) repeatedly in direction B as well as in the opposite direction in the so-called multipass mode, the uncoated substrates (1, 1', . . . ) or substrate carriers (12, 11', . . . ) being combined before entering the sputtering chamber into groups of several, preferably two substrates (1, 1', . . . ) each, and these run simultaneously through the sputtering chamber (6) in the so-called dual multipass mode.

REFERENCES:
patent: 3584847 (1971-06-01), Hammond et al.
patent: 3793167 (1974-02-01), Glaser
patent: 3945903 (1976-03-01), Svendor et al.
patent: 4261808 (1981-04-01), Walter
patent: 4274936 (1981-06-01), Love
patent: 4562093 (1985-12-01), Mario et al.
patent: 4587002 (1986-05-01), Bok
patent: 4851095 (1989-07-01), Sixbey et al.
"Decoupling of processes in coating systems by pumped buffers" in Vacuum, vol. 38, No. 8-10, pp. 677-681, 1988.

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