Method and apparatus for the attachment of particles to a substr

Details Method and apparatus for the attachment of particles to a substr Method and apparatus for the attachment of particles to a substr

1999-02-19

2000-06-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438618, H01L 2144

Patent

active

060718013

ABSTRACT:
A method for populating an substrate (14) with particles (12, 16), comprising the steps of applying an adhesive coating (22) to both surfaces of a substrate (14) and loading the particles (12, 16) to the adhesive areas (30) of the adhesive coating (22), such that each surface of the substrate (14) is fully populated with the particles (12, 16) which may thereafter be reflowed simultaneously. The particles may be composed of a variety of compositions, including copper, other metals, alloys, and synthetic resin compounds, such as conductive plastics.

REFERENCES:
patent: 5620927 (1997-04-01), Lee
patent: 5909634 (1999-06-01), Hotchkiss et al.
patent: 5930889 (1999-08-01), Klein

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