Method and apparatus for testing semiconductor devices using...

Details Method and apparatus for testing semiconductor devices using... Method and apparatus for testing semiconductor devices using...

2000-12-28

2004-08-03

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06771088

ABSTRACT:

This application claims priority from Korean patent application No. 2000-20654 filed Apr. 19, 2000 in the name of Samsung Electronics Co., Ltd., which is herein incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to testing semiconductor devices, and more particularly a method and apparatus for testing semiconductor devices using the back side of a circuit board.
2. Description of the Related Art
After completion of the wafer-fabrication and packaging processes, semiconductor devices are tested for reliability. When testing memory devices such as SDRAM (Synchronous Dynamic Random Access Memory), Rambus DRAM or SRAM (Static Random Access Memory), the packaged device is inserted into a test socket which interfaces the device to test equipment that checks the electrical and functional characteristics as well as the reliability of the device.
Conventional test equipment, which is relatively expensive, raises the cost of the test process and consequently imposes a heavy cost burden on the end-consumer of the finished products. In addition, since conventional test equipment cannot duplicate the actual operating conditions for the device under test (DUT), the testing process has a low accuracy. Therefore, it is recognized that testing under actual conditions, where the assembled devices are actually used, is preferable to using test equipment.
In order to test memory devices under the actual operating conditions, a memory device is coupled to a mother board for a personal computer or a workstation, and tested by operating the personal computer or the workstation. Memory devices are usually coupled to mother boards by mounting several memory devices to a memory module and then plugging the memory module into a socket on the mother board.
FIG.
1
and
FIG. 2
are top and side views, respectively, showing a conventional test apparatus
150
for semiconductor devices mounted on a memory module. The memory module
15
is inserted directly into a socket
153
mounted on a mother board
151
. However, since peripheral components such as add-in boards
161
a
and
161
b
around the socket
153
obstruct the insertion and removal of the memory module
15
, it is difficult to accurately test the memory module. The lack of space around the socket
153
also makes it impossible to automate the insertion and removal of the memory module.
FIG.
3
and
FIG. 4
are top and side views, respectively, showing another conventional test apparatus
170
which prevents obstruction by peripheral components such as add-in boards
181
a
and
181
b
mounted on the mother board
171
. In order to obtain sufficient space, the test apparatus
170
employs an extension board
174
inserted into a first socket
173
and a second socket
176
. The test apparatus
170
further comprises an interconnection board
175
to test the memory module
15
. The interface board
175
is fixed to the motherboard
171
by fasteners
185
. The test apparatus
170
is an improvement over the test apparatus
150
of FIG.
1
. However, the structure increases the length of the contact points, and therefore, it is difficult to apply to high-speed products because it causes delay and/or distortion of the electrical signals. An additional problem with the test apparatus
170
is that it only provides week support for the test sockets
177
.
SUMMARY OF THE INVENTION
One aspect of the present invention is a system for testing a semiconductor device comprising a circuit board comprising circuitry adapted to provide an actual operating environment for the semiconductor device, the circuit board having a front side and a back side; and test terminals formed on the back side of the circuit board and arranged to couple the semiconductor device to the circuit board.
Another aspect of the present invention is a method for testing a semiconductor device comprising coupling the semiconductor device to the back side of a circuit board comprising circuitry adapted to provide an actual operating environment for the semiconductor device; and operating the circuitry on the circuit board.


REFERENCES:
patent: 3711626 (1973-01-01), Kilby et al.
patent: 4890199 (1989-12-01), Bentler
patent: 5557508 (1996-09-01), Sato et al.
patent: 5607538 (1997-03-01), Cooke

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