Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2009-08-17
2010-11-09
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S775000, C257SE23164, C257S754000, C257S773000
Reexamination Certificate
active
07829459
ABSTRACT:
A method and apparatus for partially strapping two polysilicon lines, each having a first end and second end, uses a metal line having a plurality of spaced apart metal segments with each metal segment partially strapping a different portion of a polysilicon line. The metal segments are arranged from the first end to the second end with the signals propagating from the second end to the first end. Where two metal segments are used, the segments have lengths ofx=2L7and L-X where L is the length between the first end and the second end. Where three segments are used, the segments have lengths of X=0.25 L, Y=0.48 L, and Z=0.27 L.
REFERENCES:
patent: 6455942 (2002-09-01), Nguyen
DLA Piper (LLP) US
Pert Evan
Silicon Storage Technology, Inc.
Soderholm Krista
LandOfFree
Method and apparatus for strapping two polysilicon lines in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for strapping two polysilicon lines in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for strapping two polysilicon lines in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4169260