Method and apparatus for stacking semiconductor wafers

Details Method and apparatus for stacking semiconductor wafers Method and apparatus for stacking semiconductor wafers

2006-10-03

2006-10-03

Lillis, Eileen D. (Department: 3652)

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

C414S796200, C414S937000, C414S404000, C414S416020, C414S416080, C414S788800, C414S802000, C414S810000

Reexamination Certificate

active

07114908

ABSTRACT:
An apparatus for stacking semiconductor wafers comprises a housing configured to releasably maintain a plurality of semiconductor wafers in fixed positions relative to the housing. The apparatus also includes a transfer guide proximate to the housing, the transfer guide configured to facilitate the transfer of the plurality of semiconductor wafers into the housing. Also included is a member configured to detach the semiconductor wafers from the housing so as to collect the semiconductor wafers into a stack.

REFERENCES:
patent: 2407782 (1946-09-01), Hardy
patent: 3915317 (1975-10-01), White et al.
patent: 3977566 (1976-08-01), Hill et al.
patent: 5735662 (1998-04-01), Nichols et al.
patent: 2002/0098067 (2002-07-01), De Luna et al.

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