Method and apparatus for sputtering of a liquid

Details Method and apparatus for sputtering of a liquid Method and apparatus for sputtering of a liquid

1991-10-31

1993-05-18

Nguyen, Nam X.

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20429812, 20429822, 20429821, 20429823, C23C 1434

Patent

active

052118240

ABSTRACT:
A method and apparatus for practicing the method of sputtering target material onto a substrate by utilizing a cathode member of a sputtering apparatus, the cathode member having an exterior surface. The method comprises applying a liquid target material to a generally downwardly exposed surface portion of the exterior surface of the cathode member such that at least a portion of the liquid target material exhibits a generally downwardly exposed surface and positioning next to the surface of the cathode member the substrate for receiving target material sputtered from the liquid target material exhibiting a generally downwardly exposed surface.

REFERENCES:
patent: 3799862 (1974-03-01), Krutenat
patent: 4422916 (1983-12-01), McKelvey
patent: 4443318 (1984-04-01), McKelvey
patent: 4530750 (1985-07-01), Aisenberg et al.
patent: 5064520 (1991-11-01), Miyake et al.
patent: 5065697 (1991-11-01), Yoshida et al.

Affiliated with

Also associated with

Rating

Method and apparatus for sputtering of a liquid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for sputtering of a liquid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for sputtering of a liquid will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-802157