Method and apparatus for sputtering a superconductor onto a subs

Details Method and apparatus for sputtering a superconductor onto a subs Method and apparatus for sputtering a superconductor onto a subs

1988-03-07

1989-05-30

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 204298, 505816, C23C 1434, B05D 512

Patent

active

048348562

ABSTRACT:
A method for sputter deposition of films or coatings over large areas or at widely different substrate locations relative to the target where the coating is of exactly the same component composition as the target from where the material is being sputtered. This is accomplished by sputtering in a noble gas or other vapor plasma through ion bombarding of at least one spherical or partially spherical target. Superconductors, as well as many other multicomponent materials, can be sputter deposited on a substrate with unchanged composition by utilizing a spherical target in a low gas or vapor pressure plasma.

REFERENCES:
patent: 3021271 (1962-02-01), Wehner
patent: 3616402 (1971-10-01), Kumagai
patent: 3649502 (1972-03-01), Herte et al.
patent: 3988232 (1976-10-01), Wasa et al.
R. E. Somekh et al, Nature, vol. 326, pp. 857-859 (Apr. 1987).
H. Adachi et al., Jap. J. Appl. Phys., vol. 26, pp. L709-L710 (May 1987).
M. Kawasaki et al., Jap. J. Appl. Phys., vol. 26, pp. L738-L740 (May 1987).

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