Method and apparatus for slurry polishing

Details Method and apparatus for slurry polishing Method and apparatus for slurry polishing

1999-04-28

2000-08-29

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, 216 88, 216 89, 438693, 438745, H01L 2100

Patent

active

061108324

ABSTRACT:
A method and apparatus for Chemical-Mechanical Polishing of semiconductor wafers using various formulations of high viscosity slurry.

REFERENCES:
patent: 4323422 (1982-04-01), Calawa et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5478435 (1995-12-01), Murphy et al.
patent: 5658185 (1997-08-01), Morgan et al.
patent: 5896870 (1999-04-01), Huynh et al.
J. M. Steigerwald, et al, "Chemical Mechanical Planarization of Microelectronic Materials," Section 3.2, pp 40-41.

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