Method and apparatus for slicing semiconductor ingots

Details Method and apparatus for slicing semiconductor ingots Method and apparatus for slicing semiconductor ingots

1984-01-10

1984-08-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156645, 156654, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

044655509

ABSTRACT:
A method and apparatus for slicing solid materials, such as silicon, germanium, glass, ceramics, gallium arsenide, etc. by reactive chemicals which are carried to the workpiece by a travelling flexible member such as a wire or cable. More particularly, the invention relates to a method and apparatus for slicing ingots of the above-mentioned substances into wafers for use in the fabrication of integrated circuit, solar cells and the like. The reactive chemical preferably is a molten salt which reacts with the semiconductive material, and the flexible member is preferably electrically conductive and heated by passing a current through such member to ensure that the salt is reactive only at the location of contact of such flexible member with the ingot being sliced.

REFERENCES:
patent: 2809103 (1957-10-01), Alexander
patent: 3421956 (1969-01-01), Ebert et al.
patent: 3915770 (1975-10-01), Santillo
patent: 3971683 (1976-07-01), Briska et al.
patent: 4343662 (1982-08-01), Gay
Ind. Lab. (USA), vol. 38, No. 4, Apr. 1972, Machine for Deformation-Free Cutting of Metals, V. I. Babenko et al., pp. 604 and 605.
Indian J. Technol., vol. 12, No. 1, Jan. 1974, An Apparatus for Cutting Metallic Single Crystals, Anand, pp. 40-42.

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