Method and apparatus for slicing crystalline wafers aided by mag

Details Method and apparatus for slicing crystalline wafers aided by mag Method and apparatus for slicing crystalline wafers aided by mag

1989-07-24

1991-07-09

Wider, Kenneth

Electricity: measuring and testing

Magnetic

Displacement

G01B 714

Patent

active

050309102

ABSTRACT:
In a method and apparatus for monitoring the path of the cut in slicing wrs from non-magnetizble crystalline workpieces with a slicing tool which is moved through the workpiece, a measuring unit is disposed in a defined position with respect to the slicing tool and a constant magnetic field is established between the measuring unit and the slicing tool. The magnetic field during the slicing process passes at least partly through the wafer to be sliced off and varies with deviations of the slicing tool from the required line of cut established between the fixed measuring unit and the slicing tool. By measuring the change in the constant field caused by the deviation of the slicing tool, the slicing tool can be brought back into the required direction again by regulation so that wafers with excellent planarity are obtained.

REFERENCES:
patent: 4198006 (1980-04-01), Rolfe
patent: 4205797 (1980-06-01), Bennett, Jr. et al.
patent: 4438754 (1984-03-01), Nanny et al.

Affiliated with

Also associated with

Rating

Method and apparatus for slicing crystalline wafers aided by mag does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for slicing crystalline wafers aided by mag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for slicing crystalline wafers aided by mag will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-620554