Method and apparatus for shielding integrated circuits

Details Method and apparatus for shielding integrated circuits Method and apparatus for shielding integrated circuits

2006-02-28

2006-02-28

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000

Reexamination Certificate

active

07005323

ABSTRACT:
Some embodiments of the invention cover the top of a flip chip IC with a conductive adhesive material. This material is used in place of a shielding metal can or plate in some embodiments, while it is used in conjunction with such metal can or plate in other embodiments of the invention. Also, some embodiments use a printing technique to coat the top of the flip chip with the conductive adhesive material. In some embodiments, the coating material is a silver paste.

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patent: 2003124029 (2003-04-01), None

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