Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Patent
1997-05-05
2000-09-19
Grant, William
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
G06F 1900
Patent
active
061225622
ABSTRACT:
A method and apparatus that accurately marks a wafer at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen for retaining a wafer in a substantially horizontal orientation and a marking assembly mounted above the wafer platen. The marking assembly further contains an optical microscope and a marking head. In operation, a user locates a defect using the optical microscope and places a pattern of fiducial marks at a predetermined distance from the defect, e.g., four marks in a diamond pattern circumscribing the defect.
REFERENCES:
patent: 4390789 (1983-06-01), Smith et al.
patent: 4467211 (1984-08-01), Smith et al.
patent: 4568879 (1986-02-01), Nakamura et al.
patent: 5204912 (1993-04-01), Schimanski
patent: 5238499 (1993-08-01), Van De Ven et al.
patent: 5473409 (1995-12-01), Takeda et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5497007 (1996-03-01), Uritsky et al.
patent: 5521709 (1996-05-01), Bossen et al.
patent: 5537325 (1996-07-01), Iwakiri et al.
patent: 5563520 (1996-10-01), Terada
patent: 5610102 (1997-03-01), Gardopee et al.
patent: 5640100 (1997-06-01), Yamagata et al.
patent: 5649169 (1997-07-01), Berezin et al.
patent: 5706091 (1998-01-01), Shiraishi
patent: 6021380 (2000-02-01), Fredrikson et al.
patent: 6052185 (2000-04-01), Banet et al.
Kinney Patrick D.
Rao Nagaraja
Uritsky Yuri
Applied Materials Inc.
Grant William
Rapp Chad
LandOfFree
Method and apparatus for selectively marking a semiconductor waf does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for selectively marking a semiconductor waf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for selectively marking a semiconductor waf will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1082865