Method and apparatus for selectively marking a semiconductor waf

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G06F 1900

Patent

active

061225622

ABSTRACT:
A method and apparatus that accurately marks a wafer at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen for retaining a wafer in a substantially horizontal orientation and a marking assembly mounted above the wafer platen. The marking assembly further contains an optical microscope and a marking head. In operation, a user locates a defect using the optical microscope and places a pattern of fiducial marks at a predetermined distance from the defect, e.g., four marks in a diamond pattern circumscribing the defect.

REFERENCES:
patent: 4390789 (1983-06-01), Smith et al.
patent: 4467211 (1984-08-01), Smith et al.
patent: 4568879 (1986-02-01), Nakamura et al.
patent: 5204912 (1993-04-01), Schimanski
patent: 5238499 (1993-08-01), Van De Ven et al.
patent: 5473409 (1995-12-01), Takeda et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5497007 (1996-03-01), Uritsky et al.
patent: 5521709 (1996-05-01), Bossen et al.
patent: 5537325 (1996-07-01), Iwakiri et al.
patent: 5563520 (1996-10-01), Terada
patent: 5610102 (1997-03-01), Gardopee et al.
patent: 5640100 (1997-06-01), Yamagata et al.
patent: 5649169 (1997-07-01), Berezin et al.
patent: 5706091 (1998-01-01), Shiraishi
patent: 6021380 (2000-02-01), Fredrikson et al.
patent: 6052185 (2000-04-01), Banet et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for selectively marking a semiconductor waf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for selectively marking a semiconductor waf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for selectively marking a semiconductor waf will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1082865

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.