Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation
Reexamination Certificate
2005-09-30
2008-12-02
Lau, Tung S (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Quality evaluation
C702S084000, C702S183000, C702S184000, C700S108000, C700S109000, C700S110000, C700S121000
Reexamination Certificate
active
07460968
ABSTRACT:
The present invention provides a method and apparatus for selecting wafers for sampling. The method includes determining a plurality of sampling rules associated with at least one of a plurality of wafers and selecting at least one wafer for sampling based on the plurality of sampling rules.
REFERENCES:
patent: 7089075 (2006-08-01), Hasan
patent: 2003/0169064 (2003-09-01), Pirkle et al.
patent: 2005/0033467 (2005-02-01), Purdy
Cunningham, Sean Patrick. “The Development and Use of In-line Yield Estimates in Semiconductor Manufacturing”, 1995.
Good Richard P.
Purdy Matthew A.
Advanced Micro Devices , Inc.
Kundu Sujoy K
Lau Tung S
Williams Morgan & Amerson
LandOfFree
Method and apparatus for selecting wafers for sampling does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for selecting wafers for sampling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for selecting wafers for sampling will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4026149