Method and apparatus for selecting wafers for sampling

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation

Reexamination Certificate

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Details

C702S084000, C702S183000, C702S184000, C700S108000, C700S109000, C700S110000, C700S121000

Reexamination Certificate

active

07460968

ABSTRACT:
The present invention provides a method and apparatus for selecting wafers for sampling. The method includes determining a plurality of sampling rules associated with at least one of a plurality of wafers and selecting at least one wafer for sampling based on the plurality of sampling rules.

REFERENCES:
patent: 7089075 (2006-08-01), Hasan
patent: 2003/0169064 (2003-09-01), Pirkle et al.
patent: 2005/0033467 (2005-02-01), Purdy
Cunningham, Sean Patrick. “The Development and Use of In-line Yield Estimates in Semiconductor Manufacturing”, 1995.

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