Method and apparatus for securely holding a substrate during dic

Details Method and apparatus for securely holding a substrate during dic Method and apparatus for securely holding a substrate during dic

1998-09-18

2000-12-26

Niebling, John F.

Metal working

Barrier layer or semiconductor device making

269 21, 438460, 451388, H01L 2100

Patent

active

061652326

ABSTRACT:
A nest mechanism which is arranged to support a substrate during a dicing process, and methods for using such a nest mechanism, are disclosed. According to one aspect of the present invention, a nest apparatus supports a substrate, which includes a chip, a first side, and a second side, during a dicing process, includes an alignment mechanism that positions the substrate with respect to the nest apparatus. The nest apparatus also includes a grid arrangement that defines an opening which receives a contact which is included on the second side of the substrate. In one embodiment, the alignment mechanism is an alignment pin that engages the substrate, as for example through an opening in the substrate, to hold the substrate.

REFERENCES:
patent: 3809050 (1974-05-01), Chough et al.
patent: 3976288 (1976-08-01), Cuomo et al.
patent: 4004955 (1977-01-01), Dost et al.
patent: 4046985 (1977-09-01), Gates
patent: 4600936 (1986-07-01), Khoury et al.
patent: 4685363 (1987-08-01), Gerber
patent: 5710065 (1998-01-01), Alfaro
patent: 5803797 (1998-09-01), Piper

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