Method and apparatus for scheduling wafer processing within a mu

Details Method and apparatus for scheduling wafer processing within a mu Method and apparatus for scheduling wafer processing within a mu

1998-01-29

2000-06-13

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

36446807, H01L 2177, H01L 2102

Patent

active

06074443&

ABSTRACT:
Apparatus and concomitant method for performing priority-based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool) having a dual blade wafer transfer mechanism. The sequencer assigns priority values to the chambers in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the wafer transfer mechanism to move the wafers in a particular stage.

REFERENCES:
patent: 5375061 (1994-12-01), Hara et al.
patent: 5402350 (1995-03-01), Kline

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