Cutting – Processes
Patent
1990-02-13
1991-02-12
Phan, Hien H.
Cutting
Processes
51 73R, 82118, 82130, 82 702, 125 1302, B23Q 1709, B23Q 1512, B24D 512, B28D 104
Patent
active
049914758
ABSTRACT:
The invention is a method and apparatus for sawing bar-shaped workpieces o slices by means of an annular saw. The saw blade deviation, from its nominal position in the axial direction during the sawing operation, is compensated for. According to the invention, the deviation can be compensated for by the workpiece and the clamping system of the saw blade performing an appropriate relative translatory axial movement in accordance with the measured deviation. This movement is conveniently controlled by a computer, which compares the actual and nominal position of the saw blade with one another. The method can be used especially in the sawing of semiconductor bars.
REFERENCES:
patent: 4377958 (1983-03-01), Leighton
patent: 4502459 (1985-03-01), Dyer
patent: 4537177 (1985-08-01), Stecre, Jr. et al.
patent: 4653361 (1987-03-01), Zobeli
patent: 4771759 (1988-09-01), Zoebeli
patent: 4844047 (1989-07-01), Brehm et al.
Malcok Hanifi
Zwirglmaier Hermann
Peterson Kenneth E.
Phan Hien H.
Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
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