Method and apparatus for retrofitting semiconductor chip...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000

Reexamination Certificate

active

11039737

ABSTRACT:
A method and apparatus for retrofitting semiconductor chip performance analysis tools with full-chip thermal analysis capabilities is provided. One embodiment of a novel method for performing performance analysis of a semiconductor chip design includes receiving at least one input calculated in accordance with an actual (e.g., purposefully calculated rather than assumed or estimated) temperature of a semiconductor device and/or an interconnects in the semiconductor ship design. This input is then used to assess at least one temperature-dependent performance parameter of the semiconductor chip design.

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Wang, Ting-Yuan, et al., “3D Thermal-ADI- An Efficient Chip-Level Transient Thermal Simulator”, ISPD'03, Apr, 6-9, 2003, Monterey, California, USA http://www.ece.wisc.edu/˜vlsi/research/ISPD2003—p005-wang.pdf, Copy consists of “8” unnumbered pages.
Wang, Ting-Yuan, et al., “3-D Thermal-ADI: A linear-Time Chip Level Transient Thermal Simulator”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 21, No. 12, dated Dec. 2002, pp. 1434-1445.
Wang, Ting-Yuan, et al., “Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method”, ISPD'01, Apr. 1-4, 2001, Sonoma, California, USA http://www.ece.wisc.edu/˜vlsi/research/ISPD2001—wang.pdf, Copy consists of “6” unnumbered pages.

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