Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2007-09-11
2007-09-11
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S033000
Reexamination Certificate
active
10420228
ABSTRACT:
A method for cleaning a semiconductor device has the steps of securing a wafer (16) with a modified chuck (11) and applying a cleaning solution (18) to the backside (20) of the wafer (16). The cleaning solution (18) is formulated to remove PTFE from the wafer (16). The cleaning solution (18) is applied to the edge (14) of the wafer (16) because of the characteristics of the modified chuck (11) to remove PTFE impurities that gather on the edge (14) of the wafer (16).
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Barr Michael
Brady III W. James
Garner Jacqueline J.
Husband Sarah E.
Telecky , Jr. Frederick J.
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