Method and apparatus for removing particles from semiconductor w

Metal working – Barrier layer or semiconductor device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

15 151, 134 13, 438906, H01L 2130

Patent

active

059720514

ABSTRACT:
Discloses is an apparatus and method for cleaning the edges of semiconductor wafers by using a particle withdrawing means having pre-formed, low-tack adhesive material that removes the particles from the edges of the wafers and retains the particles thus removed.

REFERENCES:
patent: 2142039 (1938-12-01), Abrams et al.
patent: 2532011 (1950-11-01), Dahlquist et al.
patent: 2607711 (1952-08-01), Hendricks
patent: 3083393 (1963-04-01), Nappi
patent: 3119714 (1964-01-01), Ehrlich
patent: 3128202 (1964-04-01), Schilling
patent: 3189581 (1965-06-01), Hart et al.
patent: 3268357 (1966-08-01), Hart et al.
patent: 3328482 (1967-06-01), Northrup et al.
patent: 3527659 (1970-09-01), Keil
patent: 3665543 (1972-05-01), Nappi
patent: 3983298 (1976-09-01), Hahn et al.
patent: 4107811 (1978-08-01), Imsande
patent: 4171397 (1979-10-01), Morrow
patent: 4313988 (1982-02-01), Koshar et al.
patent: 4427726 (1984-01-01), Wolfrom
patent: 4490870 (1985-01-01), Taub
patent: 4559250 (1985-12-01), Paige
patent: 4599265 (1986-07-01), Esmay
patent: 4645711 (1987-02-01), Winslow et al.
patent: 4718967 (1988-01-01), Irie
patent: 4762680 (1988-08-01), Pennace et al.
patent: 4777804 (1988-10-01), Bowling et al.
patent: 4810574 (1989-03-01), Ahner
patent: 4839206 (1989-06-01), Waldenberger
patent: 4917975 (1990-04-01), De Guzman
patent: 4961804 (1990-10-01), Aurichio
patent: 4987286 (1991-01-01), Allen
patent: 5171398 (1992-12-01), Miyamoto
Adhesives Technology--Developments Since 1979, Ed. M. Gutcho, (1983), pp. 58-60, Noyes Data Corporation, Park Ridge, New Jersey.
Shields, J., Adhesives Handbook, Third Edition (1984), pp. 2-6.
Satas, D. Handbook of Pressure-Sensitive Adhesive Technology, Van Nostrand Reinhold Co. (1982), pp. 39-47 and 228-231.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for removing particles from semiconductor w does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for removing particles from semiconductor w, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for removing particles from semiconductor w will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-758720

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.