Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1987-10-09
1989-08-22
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
156345, 156643, 20419232, 204298, C23F 102
Patent
active
048593036
ABSTRACT:
In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, positively charged species are removed from an activated gas flow before the gas flow is brought into contact with the coating to strip the coating from the substrate. The positively charged species may be removed by bringing the activated gas into contact with a grounded conducting surface to discharge the positively charged species, or by passing the activated gas through a negatively charged electrostatic filter to filter out positively charged species. The removal of positively charged species from the gas flow reduces or eliminates build up of positive charge on an outer surface of the photoresist coating so as to avoid driving mobile positively charged ions from the photoresist into the substrate, thereby avoiding contamination of the substrate.
REFERENCES:
patent: 3879597 (1975-04-01), Bersin
patent: 4158589 (1979-06-01), Keller et al.
patent: 4358686 (1982-11-01), Kinoshita
patent: 4512868 (1985-04-01), Fujimura et al.
patent: 4540466 (1985-09-01), Nishizawa
patent: 4595484 (1968-06-01), Giammarco et al.
patent: 4609428 (1986-09-01), Fujimura
patent: 4631105 (1986-12-01), Carroll et al.
patent: 4673456 (1987-06-01), Spencer
patent: 4699689 (1987-10-01), Bersin
patent: 4718974 (1988-01-01), Minaee
patent: 4718976 (1988-01-01), Fujimura
Ellul Joseph P.
Kalnitsky Alexander
Poirier Jacques G.
Tay Sing P.
Austin R. J.
Junkin C. W.
Leader W. T.
Niebling John F.
Northern Telecom Limited
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