Method and apparatus for removing coating from substrate

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20419235, 20419236, 204298, 156345, 156643, H01L 21306, B44C 122, C23C 1422

Patent

active

048369020

ABSTRACT:
In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, ultraviolet radiation generated as a byproduct of plasma generation is absorbed by a baffle placed between a plasma source and the substrate. The baffle inhibits incidence of ultraviolet light on the substrate while permitting flow of activated gas onto the substrate to chemically strip the photoresist from the substrate. Use of the baffle reduces microscopic damage to the substrate.

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patent: 4718976 (1988-01-01), Fujimura

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