Method and apparatus for removal of subsurface damage in semicon

Details Method and apparatus for removal of subsurface damage in semicon Method and apparatus for removal of subsurface damage in semicon

1992-02-27

1993-08-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 156662, 156345, 134 1, H01L 21306, B44C 122

Patent

active

052385329

ABSTRACT:
A high pressure plasma is used in conjunction with a plasma assisted chemical etching material removal tool 10 to rapidly remove subsurface damage from a substrate without mechanically contacting the surface and without introducing new microscopic or atomic damage to the substrate.

REFERENCES:
patent: 3943047 (1976-03-01), Cruzan et al.
patent: 4874460 (1989-10-01), Nakagawa et al.
patent: 4964940 (1990-10-01), Auvert et al.
patent: 5009738 (1991-04-01), Gruenwald et al.
patent: 5076877 (1991-12-01), Ueda et al.

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