Method and apparatus for reducing substrate edge effects in...

Details Method and apparatus for reducing substrate edge effects in... Method and apparatus for reducing substrate edge effects in...

2005-06-07

2005-06-07

Lee, John R. (Department: 2881)

Radiant energy

Inspection of solids or liquids by charged particles

Electron probe type

C250S311000, C428S620000, C324S754120, C324S750010

Reexamination Certificate

active

06903338

ABSTRACT:
One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under an electron beam, and applying a voltage to a conductive element of the substrate holder. The voltage applied to the conductive element reduces a substrate edge effect. Another embodiment disclosed relates to an apparatus for holding a substrate that reduces a substrate edge effect. The apparatus includes a holding place for insertion of the substrate and a conductive element. The conductive element is positioned so as to be located within a gap between an edge of the holding place and an edge of the substrate.

REFERENCES:
patent: 4877326 (1989-10-01), Chadwick et al.
patent: 5973323 (1999-10-01), Adler et al.
patent: 6566897 (2003-05-01), Lo et al.
patent: 6710342 (2004-03-01), Jau et al.
Suzuki et al., “Workpiece Holder, Semiconductor Fabricating Apparatus, Semiconductor Inspection Apparatus . . . ”, Pub. No.: US 2003/0155508 A1, pub. date: Aug. 21, 2003.

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