Method and apparatus for reducing He backside faults during...

Details Method and apparatus for reducing He backside faults during... Method and apparatus for reducing He backside faults during...

2005-05-31

2005-05-31

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

C156S345310, C156S345320, C156S345510, C015S021100

Reexamination Certificate

active

06899109

ABSTRACT:
A system for processing a wafer includes a cleaning module configured to only clean the back side of the wafer so as to remove unwanted particles therefrom before performing subsequent processing tasks on the process side of the wafer. The system also includes a processing module configured to perform processing tasks on the process side of the wafer. The processing module includes a chuck for supporting the wafer during the processing task. The system further includes a transport module configured to remove the cleaned wafer from the cleaning module, move it to the processing module and place it on the chuck of the processing module without performing any intervening manipulations during the movement.

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