Method and apparatus for recovering copper and regenerating ammo

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156666, 156656, 156345, B44C 122, C23F 100

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active

051887037

ABSTRACT:
The present invention is a method and apparatus for recovering copper (Cu) and regenerating ammoniacal etchant from spent ammoniacal etchant for the process of milling printed circuit boards. The basic steps of the present invention include (a) adding an adequate amount of hydrochloric acid (HCl) into a spent ammoniacal etchant containing copper ions (Cu.sup.2+), ammonium ions (NH.sub.4.sup.+) and chloride ions (Cl.sup.-) to produce an acidified spent ammoniacal etchant having a pH value in the range of between approximately 3 and approximately 6 and having increased concentrations of the ammonium ions (NH.sub.4.sup.+) and the chloride ions (Cl.sup.-) substantially stoichiometrically equivalent to that of the copper ions (Cu.sup.2+), so that all copper (Cu) contained in the acidified spent ammoniacal etchant is substantially precipitated as double salt copper ammonium chloride [(NH.sub.4).sub.2 CuCl.sub.4(S) ]; (b) separating the double salt copper ammonium chloride [(NH.sub.4).sub.2 CuCl.sub.4(s) ] from the acidified spent ammoniacal etchant; (c) recovering copper (Cu) from the separated double salt copper ammonium chloride [(NH.sub.4).sub.2 CuCl.sub.4(s) ] ; and (d) regenerating ammoniacal etchant from the separated spent ammoniacal etchant.

REFERENCES:
patent: 3760070 (1973-09-01), James et al.
patent: 4058431 (1977-11-01), Haas
patent: 4252621 (1981-02-01), Reinhardt et al.
patent: 4576677 (1986-03-01), Faul et al.

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