Method and apparatus for reactive sputtering employing two contr

Details Method and apparatus for reactive sputtering employing two contr Method and apparatus for reactive sputtering employing two contr

1998-04-16

2000-08-22

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429801, 20429808, 20419212, 20419215, C23C 1434

Patent

active

061066761

ABSTRACT:
The present invention is a cascade control system for reactive sputtering deposition. A first control loop modifies the power supply in order to keep a monitored value nearly constant. This first control loop can be done relatively quickly. A second control loop monitors a second measure parameter in order to control the reactive gas flow to the system. In a preferred embodiment, the slower control loop is used to maintain a relatively constant power at the power supply.

REFERENCES:
patent: 4124474 (1978-11-01), Bomchil et al.
patent: 4166784 (1979-09-01), Chapin et al.
patent: 4201645 (1980-05-01), Riegert
patent: 4407709 (1983-10-01), Enjouji et al.
patent: 4428811 (1984-01-01), Sproul et al.
patent: 4888199 (1989-12-01), Felts et al.
patent: 4895631 (1990-01-01), Wirz et al.
patent: 4936964 (1990-06-01), Nakamura
patent: 5108569 (1992-04-01), Gilboa et al.
patent: 5126028 (1992-06-01), Hurwitt et al.
patent: 5292417 (1994-03-01), Kugler
patent: 5556520 (1996-09-01), Latz
patent: 5607559 (1997-03-01), Yamada et al.
patent: 5618575 (1997-04-01), Peter
patent: 5665214 (1997-09-01), Iturralde
.ANG.strom, Karl J. and Hagglund, Tore; PID Controllers: Theory, Design, and Tuning; Second Edition; Instrument Society of America; 1995.

Affiliated with

Also associated with

Rating

Method and apparatus for reactive sputtering employing two contr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for reactive sputtering employing two contr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for reactive sputtering employing two contr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-576418