Method and apparatus for providing optical proximity...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C716S030000, C257SE21023

Reexamination Certificate

active

10756830

ABSTRACT:
A method of generating a mask design having optical proximity correction features disposed therein. The methods includes the steps of obtaining a desired target pattern having features to be imaged on a substrate; determining an interference map based on the target pattern, the interference map defining areas of constructive interference and areas of destructive interference between at least one of the features to be imaged and a field area adjacent the at least one feature; and placing assist features in the mask design based on the areas of constructive interference and the areas of destructive interference.

REFERENCES:
patent: 5229230 (1993-07-01), Kamon
patent: 5682323 (1997-10-01), Pasch et al.
patent: 5895741 (1999-04-01), Hasegawa et al.
patent: 6037082 (2000-03-01), Capodieci
patent: 6214497 (2001-04-01), Stanton
patent: 6223139 (2001-04-01), Wong et al.
patent: 6303253 (2001-10-01), Lu
patent: 6355382 (2002-03-01), Yasuzato et al.
patent: 6413684 (2002-07-01), Stanton
patent: 6519760 (2003-02-01), Shi et al.
patent: 6777141 (2004-08-01), Pierrat
patent: 6787271 (2004-09-01), Cote et al.
patent: 6792591 (2004-09-01), Shi et al.
patent: 6807662 (2004-10-01), Toublan et al.
patent: 2002/0083410 (2002-06-01), Wu et al.
patent: 2002/0152452 (2002-10-01), Socha
patent: 2002/0157081 (2002-10-01), Shi et al.
patent: 2003/0228541 (2003-12-01), Hsu et al.
patent: 2004/0122636 (2004-06-01), Adam
patent: 2006/0147815 (2006-07-01), Melvin, III
patent: 1 202 119 (2002-05-01), None
patent: 1 237 046 (2002-09-01), None
patent: WO 02/03140 (2002-01-01), None
patent: WO 03/054626 (2003-07-01), None
Christoph Dolainsky, et al., “Simulation based method for sidelobe suppression,” Optical Microlithography XIII, Proceedings of SPIE, 2000, pp. 1156-1162, vol. 4000.
Kyoji Nakajo, et al., “Auxiliary pattern generation to cancel unexpected images at sidelobe overlap regions in attenuated phase-shift masks,” Proc. SPIE vol. 3748 (1999).
Nicolas Bailey Cobb, “Fast Optical and Process Proximity Correction Algorithms for Integrated Circuit Manufacturing,” Ph.D. dissertation, Spring 1998, pp. 35-72, University of California at Berkeley.
J. Fung Chen, et al., “Practical I-Line OPC Contact Masks for Sub-0.3Micron Design Rule Application: Part 1—OPC Design Optimization,” pp. 181-201 Proc. Microlithography Seminar (1997).
J.A. Torres, et al., “Contrast-Based Assist Feature Optimization,” Optical Microlithography XV, 2002, pp. 179-187, Proceedings of SPIE, vol. 4691, SPIE.
Olivier Toublan, et al., “Fully Automatic Side Lobe Detection and Correction Technique for Attenuated Phase Shift Masks,” Optical Microlithography XIV, 2001, pp. 1541-1547, Proceedings of SPIE, vol. 4346, SPIE.
Michael S. Yeung, “Extension of the Hopkins theory of partially coherent imaging to include thin-film interference effects,” Optical/Laser Microlithography VI, 1993, pp. 452-463, SPIE, vol. 1927.
Douglas Van Den Broeke, et al., “Near 0.3 k, Full Pitch Range Contact Hole Patterning Using Chromeless Phase Lithography (CPL),” Proceediings of the SPIE, Sep. 9, 2003, pp. 297-308, vol. 5256, SPIE.

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