Method and apparatus for providing interconnection between metal

Details Method and apparatus for providing interconnection between metal Method and apparatus for providing interconnection between metal

1989-07-27

1990-10-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437190, 357 71, H01L 2144, H01L 2148

Patent

active

049635107

ABSTRACT:
A metal stud (24) is provided for interconnecting levels of metallization separated by an insulator on a semiconductor slice (10). A lead (12) is coated with a refractory metal (14) and a platable metal cap (16). A photoresist (18) is then applied and a cavity (22) is formed within the photoresist (18). The cavity (22) is plated to form the stud (24). The stud (24) is clad with a corrosion resistant layer (28).

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patent: 4410622 (1983-10-01), Dalal et al.
patent: 4614021 (1986-09-01), Hulseweh
patent: 4670091 (1987-06-01), Thomas et al.
patent: 4725877 (1988-02-01), Brasen et al.
patent: 4789647 (1988-12-01), Peters
S. Ghandhi, VLSI Fabrication Principles, John Wiley & Sons, New York, (1983), pp. 422-424 and 458-461.
R. E. Oakley et al, "Pillars--The Way to Two Micron Pitch Multilevel Metallisation", Jun. 21-22, 1984, V-MIC Conference, pp. 23-29.

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