Method and apparatus for protecting functions imbedded within an

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257901, 257906, 257908, 257379, 257350, 257368, 257395, 257392, 257360, 257393, H01L 2710, H01L 2978

Patent

active

058616527

ABSTRACT:
The present invention provides an integrated circuit chip having one or more circuit elements that perform a desired circuit function with the circuit elements being encompassed by a molding compound that forms a package for the chip. The molding compound has a capacitance associated with it. The integrated circuit chip includes a second integrated circuit element within the molding compound in which the second integrated circuit element monitors the molding compound to detect a change in capacitance in the molding compound resulting from a removal of a portion or all of the molding compound. In response to a detection of a change in capacitance, the second integrated circuit element alters the desired circuit function provided by the other integrated circuit elements.

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