Method and apparatus for producing uniform isotropic...

Details Method and apparatus for producing uniform isotropic... Method and apparatus for producing uniform isotropic...

2006-12-26

2006-12-26

Nguyen, Nam (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192100, C204S192130, C204S298020, C204S298120, C204S298230, C204S298260, C204S298270

Reexamination Certificate

active

07153399

ABSTRACT:
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of transport speed are presented, which together allow the achievement of the maximum stress that the film material can hold while avoiding X-Y stress anisotropy and avoiding stress non-uniformity across the substrate.

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