Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-06-18
1994-01-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 118723I, 20419212, 20419232, 20429802, 20429808, 20429834, 427569, H01L 2100
Patent
active
052777510
ABSTRACT:
An embodiment of the present invention is a plasma system that comprises a main coil with a flattened side and a capacitor in parallel that form a tuned circuit with radio frequency energy coupled to it through a radio frequency match by a generator. A process chamber with a quartz window and containing a low pressure gas is adjacent to the flat side of the main coil and a two-dimensional planar plasma in the shape of a circular disk is ignited and maintained by a high rate of change of the current flowing in the main coil. An electrode positioned in the chamber opposite to the window is used for attaching a semiconductor wafer for processing and a potential applied to the electrode independently controls the ion energy of ions attracted and accelerated out of the plasma.
REFERENCES:
patent: 3705091 (1972-12-01), Jacob
patent: 4123316 (1978-10-01), Tsuchimoto
patent: 4786352 (1988-11-01), Benzing
patent: 4810935 (1989-03-01), Boswell
patent: 4948458 (1990-08-01), Ogle
Dang Thi
Schatzel Thomas E.
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