Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1996-06-17
1998-02-10
Chapman, Mark
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430 5, 437 80, G03C 500
Patent
active
057167591
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to methods and apparatus for producing integrated circuit devices.
BACKGROUND OF THE INVENTION
An essential step in the manufacture of all integrated circuit devices is known as "packaging" and involves mechanical and environmental protection of a silicon chip which is at the heart of the integrated circuit as well as electrical interconnection between predetermined locations on the silicon chip and external electrical terminals.
At present three principal technologies are employed for packaging semiconductors: wire bonding, tape automatic bonding (TAB) and flip chip.
Wire bonding employs heat and ultrasonic energy to weld gold bonding wires between bond pads on the chip and contacts on the package.
Tape automatic bonding (TAB) employs a copper foil tape instead of bonding wire. The copper foil tape is configured for each specific die and package combination and includes a pattern of copper traces suited thereto. The individual leads may be connected individually or as a group to the various bond pads on the chip.
Flip chips are integrated circuit dice which have solder bumps formed on top of the bonding pads, thus allowing the die to be "flipped" circuit side down and directly soldered to a substrate. Wire bonds are not required and considerable savings in package spacing may be realized.
The above-described technologies each have certain limitations. Both wire bonding and TAB bonding are prone to bad bond formation and subject the die to relatively high temperatures and mechanical pressures. Both wire bond and TAB technologies are problematic from a package size viewpoint, producing integrated circuit devices having a die-to-package area ratio ranging from about 10% to 60%.
The flip-chip does not provide packaging but rather only interconnection. The interconnection encounters problems of uniformity in the solder bumps as well as in thermal expansion mismatching, which limits the use of available substrates to silicon or materials which have thermal expansion characteristics similar to those of silicon.
SUMMARY OF THE INVENTION
The present invention seeks to provide apparatus and techniques for production of integrated circuit device overcome many of the above limitations and provide integrated circuits of relatively smaller size and weight and enhanced electrical performance.
In applicant's pending PCT application PCT/EP92/02134 entitled Methods and Apparatus for Producing Integrated Circuit Devices filed Sep. 14, 1992, there appear various types of integrated circuit devices including devices having pads which extend over both planar and edge surfaces thereof.
The present invention seeks to provide methods and apparatus for three dimensional photolithography, which are particularly suited for producing the above-described integrated circuit devices using mask techniques.
There is thus provided in accordance with a preferred embodiment of the present invention a method for three dimensional lithography including the steps of providing a substrate having surfaces extending in three dimensions and a light sensitive coating and illuminating the substrate via a mask with light impinging on the surfaces at a non-perpendicular angle with respect thereto.
There is further provided in accordance with an embodiment of the present invention a method for photolithographic forming of metal areas on an integrated circuit device including the steps of providing an integrated circuit device substrate having surfaces extending in three dimensions and a light sensitive coating and illuminating the substrate via a mask with light impinging on the surfaces at a non-perpendicular angle with respect thereto.
There is also provided in accordance with a preferred embodiment of the present invention apparatus for three dimensional lithography including a light source for illuminating a substrate having surfaces extending in three dimensions and a light sensitive coating via a mask with light impinging on the surfaces at a non-perpendicular angle with respect thereto.
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Chapman Mark
Shellcase Ltd.
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