Method and apparatus for producing a substrate with low secondar

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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2041923, 20419232, 20419235, 20419215, 20419234, C23C 1434

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active

057118604

ABSTRACT:
The present invention is directed to a method and apparatus for producing a highly-textured surface on a copper substrate with only extremely small amounts of texture-inducing seeding or masking material. The texture-inducing seeding material is delivered to the copper substrate electrically switching the seeding material in and out of a circuit loop.

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patent: 4607193 (1986-08-01), Curren et al.
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patent: 4693760 (1987-09-01), Sioshansi
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patent: 4999096 (1991-03-01), Nihei et al.
patent: 5245248 (1993-09-01), Chan et al.
"An Effective Secondary Electron Emission Suppression Treatment for Copper MDC Electrodes "Curren et al., International Electron Devices Meeting, Washington, DC., Dec. 5-8, 1993 pp. 31.8.1-31.8.3.
International Electron Devices Meeting Washington, DC, Dec. 5-8, 1993.

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