Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2006-10-17
2006-10-17
Kackar, Ram N. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345250, C156S345260, C156S345270, C118S712000, C118S708000, C204S192100, C204S298010
Reexamination Certificate
active
07122096
ABSTRACT:
In a semiconductor processing apparatus including a process chamber, a sample stand for holding a sample in the process chamber, and a process gas supply unit for supplying a process gas to the process chamber, a plurality of samples of a lot are successively supplied to a process chamber to be successively processed in an intra-lot successive process. The apparatus includes a state sensor for detecting a state in the process chamber and an intra-lot variation pattern prediction unit for predicting, according to sensor data detected by the state sensor, intra-lot variation patterns of results of the intra-lot successive process. According to a result of the prediction by the intra-lot variation pattern prediction unit, the apparatus changes a process condition applied to a sample of the lot.
REFERENCES:
patent: 4927485 (1990-05-01), Cheng et al.
patent: 2003/0003607 (2003-01-01), Kagoshima et al.
patent: A-6-132251 (1994-05-01), None
patent: A-10-125660 (1998-05-01), None
patent: A-2001-267232 (2001-09-01), None
Kagoshima Akira
Kitsunai Hiroyuki
Shiraishi Daisuke
Tanaka Junichi
Yamamoto Hideyuki
Hitachi High-Technologies Corporation
Kackar Ram N.
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