Method and apparatus for processing samples

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438710, 156345, H01L 21302, C23F 102

Patent

active

060777885

ABSTRACT:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus, the samples being selectively etched through use of a resist mask), (b) for removing (ashing) the resist mask, (c) for wet-processing of the samples and (d) for dry-processing the samples. Samples are passed sequentially from a supply cassette (containing a plurality of samples) to the plasma etching apparatus, through the other apparatus and to a discharge cassette (which can hold a plurality of the samples). At least two of the samples can be processed simultaneously in a path from (and including), the plasma etching apparatus to (and including) the wet-processing structure.

REFERENCES:
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4824309 (1989-04-01), Kakehi et al.
patent: 4855252 (1989-08-01), Peterman et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5292393 (1994-03-01), Maydan et al.
Patent Abstracts of Japan, JP-A-55 072040, vol. 004, No. 117 (E-022), Aug. 20, 1980, Mitsubishi Electric Corp.
Database WPI, Derwent Publications Ltd., JP-A-63 157870, Jun. 30, 1988, Nichiden Anelba KK. (Abstract).
Database WPI, Derwent Publications Ltd., JP-A-63 204726, Aug. 24, 1988, Anelva Corp. (Abstract).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for processing samples does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for processing samples, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for processing samples will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1852214

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.