Method and apparatus for process endpoint prediction based on ac

Details Method and apparatus for process endpoint prediction based on ac Method and apparatus for process endpoint prediction based on ac

1993-09-22

1996-04-02

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566271, 1566431, 427 10, H01L 21306

Patent

active

055037070

ABSTRACT:
In accordance with one aspect of the present invention, a method is provided for predicting the endpoint time of a semiconductor process for a layer of a wafer (14). The endpoint time is the time at which a predetermined thickness of the layer occurs. A layer thickness, calculated for a first sample time, is received. It is then determined whether or not the layer thickness lies within a predetermined range. If the layer thickness does lie within the predetermined range, it is used to update a forecasted process rate. The forecasted process rate is used to predict the endpoint time. The endpoint time is used to control the semiconductor process so that the layer of wafer (14) is formed having the predetermined thickness.

REFERENCES:
patent: 4198261 (1980-04-01), Busta
patent: 5131752 (1992-07-01), Yu
patent: 5160576 (1992-11-01), Robbins
patent: 5270222 (1993-12-01), Moslehi
Sweet, A. L., "Using coupled EWMA control charts for montoring processes with linear trends", IIE Trans., vol. 20, No. 4, pp. 404-408, 1988.
Wright, D. J., "Forecasting data published at irregular time intervals using an extension of Holt's method", Manage. Sci., vol. 32, No. 4, pp. 499-510, 1986.

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