Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-02-28
1998-12-08
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
H01L 2144
Patent
active
058468749
ABSTRACT:
An anchor structure placed in an open field in corner areas of the semiconductor die and along die edges for preventing cracks in the die. In the corner areas, the anchor structure is placed perpendicular to a resultant vector force, which is approximately at a 45.degree. angle to an imaginary horizontal line passing through the die. This perpendicular placement of the anchor structure more uniformly distributes the stresses along the anchor preventing corner cracks in the die. Along the die edges, the anchor structures are placed approximately perpendicular to the resultant vector forces that impinge the die edges.
REFERENCES:
patent: 4625227 (1986-11-01), Hara et al.
patent: 4926234 (1990-05-01), Katoh
patent: 4928162 (1990-05-01), Lesk et al.
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5023699 (1991-06-01), Hara et al.
patent: 5468996 (1995-11-01), Chan et al.
patent: 5572067 (1996-11-01), Thalapaneni
Paul Nixon and Darvin Edwards, "Shear Stress Damage to Chips: A Design Solution", TI Technical Journel, pp. 96-108 No Date.
Integrated Circuit Engineering Corporation, Construction Analysis, "Altera EPM7256EQC160-20 EPLD", Scottdale, AZ, Report No.:SCA 9512-443, pp. 1-3, Fig. 7 No Date.
Hartranft Marc
Zicolello Pat
Bowers Charles
Cypress Semiconductor Corp.
Thompson Craig
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