Method and apparatus for pressure and plasma control during...

Details Method and apparatus for pressure and plasma control during... Method and apparatus for pressure and plasma control during...

2008-05-06

2008-05-06

Von Buhr, M. N. (Department: 2125)

Data processing: generic control systems or specific application

Generic control system, apparatus or process

Optimization or adaptive control

C700S121000

Reexamination Certificate

active

11044591

ABSTRACT:
A method and apparatus are provided for a graded PECVD process that continuously modulates a set of flow and pressure conditions while the plasma power is turned on and a film is being deposited. A feedback mechanism specific to a give deposition recipe is used to generate, optimize and maintain a dynamic profile for a first input process parameter that produces a desired dynamic profile for a first output process parameter. An iterative approach produces a gradually converging series of dynamic profiles of an input profile parameter, which eventually succeeds in producing the desired dynamic profile for the first output process parameter of the graded PECVD process.

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