Method and apparatus for precision card lamination

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

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Details

156580, 156285, 269 37, B32B 3100

Patent

active

058491414

ABSTRACT:
An apparatus for assembly of laminated components to a card base includes a main platen secured to a pair of precision linear bearings to support the card base. Rows of vacuum holes in the platen secure the card by suction effect. A removable track location key at one edge of the main platen includes detent positions engaged by a track location lock, so that the main platen may be locked at any of those positions. A transfer platen extending parallel to the main platen is pivotally secured to the machine base. The transfer platen also includes rows of vacuum holes to hold component strips by suction effect. The transfer platen is rotatable from a loading position to the main platen to deliver a component strip to a precise position on a card secured on the main platen. The method of the invention includes placing a card substrate on the main platen and securing it thereto with vacuum suction. The main platen is positioned to receive a first component strip and secured by the track lock, and the first strip is secured by vacuum to the transfer platen in the loading position. The transfer platen is rotated to impinge the first component strip on the card substrate on the main platen. Pressure sensitive adhesive surface coatings on the components join the assembly. The transfer platen is then rotated to return to the loading position, and the main platen is indexed to a second position to receive another component. This process is reiterated to apply all of the card components on the substrate in accurate placement.

REFERENCES:
patent: 3738890 (1973-06-01), Johnson et al.
patent: 4220491 (1980-09-01), Metcalf et al.
patent: 5336357 (1994-08-01), Layher et al.
patent: 5527421 (1996-06-01), Uehara et al.

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