Method and apparatus for plating through holes in graphite compo

Details Method and apparatus for plating through holes in graphite compo Method and apparatus for plating through holes in graphite compo

1988-07-27

1990-01-02

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 1700

Patent

active

048907278

ABSTRACT:
Improved method and apparatus are disclosed for through hole plating of composite materials. The apparatus of the present invention comprises a plating cell which includes a baffle plate intermediate a plating anode and the material to be plated. The baffle plate acts to distribute the plating material within the plating fluid to provide a resultant plated material of uniform thickness and adhesion. The plating cell also includes a plating fluid supply system which is remote from the plating cell to thereby allow the characteristics of the plating solution to be monitored and controlled. The method which comprises the present invention includes the step of co-curing the composite material with a plating foil prior to plating the material to provide improved adhesion of the plating material to the composite material.

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