Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent
1998-06-11
2000-09-19
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
438977, 216 86, H01L 21302
Patent
active
061211524
ABSTRACT:
Planarization of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly scanned and a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
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Adams John A.
Krulik Gerald A.
Smith Everett D.
Chen Kin-Chan
Integrated Process Equipment Corporation
Utech Benjamin L.
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