Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1994-11-30
1995-08-15
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429809, 20429819, C23C 1434
Patent
active
054416140
ABSTRACT:
A magnetron sputtering apparatus is disclosed having a cooling block including an inner conduit. A target is provided having first and second grooves in a first surface thereof. At least a portion of the first surface of the target is in contact with a first surface of the cooling block. A first pole piece is positioned within the first groove, and a second pole piece is positioned within the second groove. A first magnet is provided having a first polarity in contact with the first pole piece. A second magnet is provided having the opposite polarity of the first magnet in contact with the second pole piece. A plate is provided in contact with a second surface of the cooling block and the first and second magnets. Means are provided for supplying a coolant to the inner conduit of the cooling block and for applying a voltage to the cooling block. The first and second pole pieces conduct a magnetic flux produced by the first and second magnets towards an opposite second surface of the target.
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Krause Dennis L.
Wojewoda David C.
AT&T Corp.
Nguyen Nam
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