Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1997-11-07
1999-11-30
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429808, C23C 1434
Patent
active
059936134
ABSTRACT:
Apparatus for depositing a film of material on a substrate may comprise sputter deposition apparatus for transferring target atoms from a target to the substrate and a servo control circuit operatively associated with the sputter deposition apparatus. The servo control circuit operates the sputter deposition apparatus in an alternating manner between an "active" state and a "quiescent" state so that a power density on the target during the "active" state is at least about 400 watts per square inch of target area. During the active state, target atoms are transferred from the target to the substrate. During the quiescent state, substantially no target atoms are transferred from the target to the substrate. A polarity reversing circuit operatively associated with the servo control circuit periodically reverses a polarity on the sputter deposition apparatus during the "active" state.
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Cantelmo Gregg
Dahl, Esq. Pruce E.
Nguyen Nam
Sierra Applied Sciences, Inc.
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