Method and apparatus for optimizing bond tool pressure distribut

Details Method and apparatus for optimizing bond tool pressure distribut Method and apparatus for optimizing bond tool pressure distribut

1992-12-21

1994-05-03

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228106, 228 55, 228 9, B23K 100, B23K 300

Patent

active

053079817

ABSTRACT:
Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.

REFERENCES:
patent: 4657170 (1987-04-01), Muller
patent: 4934671 (1990-06-01), Laninga et al.
patent: 5127573 (1992-07-01), Chang et al.
patent: 5150827 (1992-09-01), Fries

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