Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-10-23
2007-10-23
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S128000, C370S380000, C257SE21495
Reexamination Certificate
active
10897582
ABSTRACT:
A network for interconnecting processing element nodes which supports rich interconnection while having a number of switching elements which is linear in the number of processing elements interconnected. Processing elements connect to the lowest level of the tree and the higher levels of the tree make connections between the processing elements. The processing elements may be laid out in a two dimensional grid and one or more horizontal and vertical trees may be used to connect between the processing elements with corner switches used to connect between the horizontal and vertical trees. The levels of the tree can be accommodated in multiple layers of metalization such that the entire layout requires a two-dimensional area which is linear in the number of processing elements supported.
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DeHon Andre
Rubin Raphael
California Institute of Technology
Ladas & Parry LLP
Lebentritt Michael
Roman Angel
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