Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2004-02-12
2010-11-23
McDonald, Rodney G (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192200, C204S298190, C204S298230, C204S298250
Reexamination Certificate
active
07837836
ABSTRACT:
A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of:(a) providing a multi-stage cathode sputtering apparatus comprising a group of spaced-apart cathode/target assemblies and a means for transporting at least one substrate/workpiece past each cathode/target assembly, each cathode/target assembly comprising a sputtering surface oriented substantially parallel to the first surface of the substrate during transport past the group of cathode/target assemblies, the group of cathode/target assemblies adapted for providing different angular sputtered film thickness profiles; and(b) transporting the substrate past each cathode/target assembly while providing different sputtered film thickness profiles from at least some of the cathode/target assemblies, such that a plurality of sub-layers is deposited on the surface of the substrate/workpiece which collectively form a uniform thickness layer of the selected material.
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Machine tranlsation of 06-158311.
Machine Translation of JP 2000-057640 dated Feb. 25, 2000.
Nolan Thomas Patrick
Ranjan Rajiv Yadav
Reiter Jeffrey Shane
McDonald Rodney G
Seagate Technology LLC
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